技术参数

• Package / Case 4-FBGA Module
• Size / Dimension 0.041" L x 0.041" W (1.04mm x 1.04mm)
• Mounting Type Surface Mount
• Interface LVDS, SEIM
• Type CMOS
• Pixel Size 2.4µm x 2.4µm
• Resolution 320 x 320
• Height (Max) 0.093" (2.36mm)
• Frames per Second 49.0
• Shutter Rolling
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)