技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Operating Temperature -55°C ~ 175°C (TJ)
• Input Type Standard
• Vce(on) (Max) @ Vge, Ic 2.4V @ 15V, 15A
• Supplier Device Package Wafer
• IGBT Type Trench Field Stop
• Voltage - Collector Emitter Breakdown (Max) 1200 V
• Current - Collector Pulsed (Icm) 60 A