技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 175°C (TJ)
• Input Type Standard
• Vce(on) (Max) @ Vge, Ic 2.1V @ 15V, 60A
• Supplier Device Package Wafer
• IGBT Type Field Stop
• Gate Charge 79 nC
• Voltage - Collector Emitter Breakdown (Max) 650 V
• Current - Collector Pulsed (Icm) 300 A