技术参数

• Size / Dimension 1.050" L x 1.150" W (26.67mm x 29.21mm)
• Mounting Type Through Hole
• Type For DC/DC Converters
• Operating Temperature -30°C ~ 130°C
• Applications Forward, Push-Pull Converters
• Voltage - Isolation 600Vrms
• Intended Chipset LM1577, LM2577
• Footprint 1.050" L x 1.150" W (26.27mm x 29.21mm)
• Chipset Manufacturer National Semiconductor
• Height - Seated (Max) 0.810" (20.57mm)
• ECCN EAR99
• HTSUS 8504.31.2000
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status RoHS Compliant